Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore by Hengyun Zhang - PDF and EPUB eBook

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Details of Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

Exact title of the book
Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Book author
Hengyun Zhang
Book edition
Paperback
Number of pages
425 pages
File size (in PDF)
1700 kB
Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore